Sting Dew
Graduated Electrical Engineering, Journalism Awardee of the Year, worked in a construction company, power plant and semiconductor company
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Sting Dew ∙ 26 Dec, 11
Encapsulation and Molding
Plasma Solution for Advanced Semiconductor Packaging & Assembly
Organic-based substrates, like those used in BGA packages and metal leadframes are susceptible to delamination. Delamination is caused by poor adhesion of the encapsulant compound to the multiple interfaces on the substrate package including solder mask, the die top passivation, and the substrate metallization. Peel tests and C-mode scanning acoustic microscopy (C-SAM) have proven that delamination issues are significantly reduced when packages are plasma treated prior to molding. Plasma processing greatly improves adhesion of mold compounds by increasing the substrate surface energy and results in increased package reliability.
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Sting Dew ∙ 26 Dec, 11
More Applications
Plasma treatment is also used for other microelectronic applications including wafer cleaning prior to wafer dice, surface activation prior to package marking, improvement in solder wetting, and to enhance the conformal coating process. In conformal coating applications the encapsulating resin may not completely wet the substrate surface resulting in coating voids and delamination. Plasma ensures that the fluid completely wets the numerous materials on the PCB and enhances the coating adhesion.
Below is the recommended cleaning procedure:
Step 1: Do 10 shots of Melamine at 175°C for 300s
Step 2: Do 3-5 shots of Mold conditioner at 175°C for 180s
Step 3: Run 2 shots of dummy shots at 175°C for 90s @ 2 shots
Step 4: Resume production as usual