Sting Dew ∙ 26 Dec, 11
Encapsulation and Molding
Plasma Solution for Advanced Semiconductor Packaging & Assembly
Organic-based substrates, like those used in BGA packages and metal leadframes are susceptible to delamination. Delamination is caused by poor adhesion of the encapsulant compound to the multiple interfaces on the substrate package including solder mask, the die top passivation, and the substrate metallization. Peel tests and C-mode scanning acoustic microscopy (C-SAM) have proven that delamination issues are significantly reduced when packages are plasma treated prior to molding. Plasma processing greatly improves adhesion of mold compounds by increasing the substrate surface energy and results in increased package reliability.